2 edition of Interactive effects of bond wires used for microwave semiconductor device combining and matching circuitry found in the catalog.
Interactive effects of bond wires used for microwave semiconductor device combining and matching circuitry
R. E Neidert
|Statement||R.E. Neidert, J.A. Willing, and B.E. Spielman|
|Series||NRL report -- 8388|
|Contributions||Willing, H. A, Spielman, B. E, Naval Research Laboratory (U.S.). Microwave Technology Branch|
|The Physical Object|
|Pagination||iii, 8 p. :|
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